Equipment & Process Engineer英语读写即可

1) Equipment management8E-VHnviW 
A) Overall control to equipments as individual equipments owner. 1[mfh ]n 
A) Continuous improvement to OEE.W B5PP`[ 
A) Repairing by on call or shift on dutyxQ"m LEI 
B) Preparation for PM document, service report.!-)r@57R 
B) Sourcing new equipment and spare parts to production

2) Process management }a
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A) Overall control to processes as individual process owner. Jvs!H!~$Q 
A) Continuous improvement to process capacity.h cP( 
A) Develop new process introduction to production|^C_v<zq 
B) Preparation for process document, validation report.

Professional Competences ^G\!C"V 
 Solid understanding on Microelectronic technology ?D,8|!%x|| 
 Practice and experience in Foundry, Wafer manufacturingn HA 
 Practice and experience in Semiconductor Packaging ProcesszAE9'NP 
 Practice and experience in electronic product assembly technology

Qualifications1W"U 
 Bachelor degree or above, major in Microelectronics\electronics@c-
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 3 or more years semiconductor packaging production or related experienceh%G>w.Lf 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences^J2Z5AgDo 
 Ability to use analysis tools, like MinitabvsO(*;l 
 Ability to use quality control tools, SPC, Six Sigmaz5#LD  
 Experience of lean manufacturing"|9jW }G: 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510