Equipment & Process Engineer英语读写即可

1) Equipment managementfysH9X~. 
A) Overall control to equipments as individual equipments owner. 8$yjl~Y 
A) Continuous improvement to OEE.[!X,;mXD 
A) Repairing by on call or shift on dutyRh>scH 
B) Preparation for PM document, service report.JX S E 
B) Sourcing new equipment and spare parts to production

2) Process managementG`H2 R
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A) Overall control to processes as individual process owner. =@[8 
A) Continuous improvement to process capacity.
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A) Develop new process introduction to productionWPV:D8k 
B) Preparation for process document, validation report.

Professional Competences\v H c3~ 
 Solid understanding on Microelectronic technology Ni\MB9g6 
 Practice and experience in Foundry, Wafer manufacturingp`W&4zVxpv 
 Practice and experience in Semiconductor Packaging ProcessA"M~F":+Oc 
 Practice and experience in electronic product assembly technology

Qualifications
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 Bachelor degree or above, major in Microelectronics\electronics/|QyvY 
 3 or more years semiconductor packaging production or related experience%G/4Fg0;B 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences?kF>l{p6 
 Ability to use analysis tools, like Minitab *uVu 
 Ability to use quality control tools, SPC, Six Sigma G\1nzY' 
 Experience of lean manufacturingOME&] (F)^ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510