Equipment & Process Engineer英语读写即可

1) Equipment management#e{?2BMw 
A) Overall control to equipments as individual equipments owner. =]D+4R 
A) Continuous improvement to OEE.*(XJ,O. 
A) Repairing by on call or shift on dutyo3;}q=Q`L 
B) Preparation for PM document, service report.wE&Us@i 
B) Sourcing new equipment and spare parts to production

2) Process management;y
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A) Overall control to processes as individual process owner. + ]sfSO"! 
A) Continuous improvement to process capacity.WOt>~ 
A) Develop new process introduction to productionbUSDpzv:Y 
B) Preparation for process document, validation report.

Professional CompetencesJz}%) gy 
 Solid understanding on Microelectronic technology V8FH8oYr 
 Practice and experience in Foundry, Wafer manufacturingE,L$)9E
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 Practice and experience in Semiconductor Packaging ProcessA+-B0z$l_ 
 Practice and experience in electronic product assembly technology

Qualifications-9eO#:+ 
 Bachelor degree or above, major in Microelectronics\electronicsmrM]B%fmD 
 3 or more years semiconductor packaging production or related experiencev((v/J 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesg<JW#r  
 Ability to use analysis tools, like MinitabJ6$lsxwE ' 
 Ability to use quality control tools, SPC, Six Sigmat!eC1M 
 Experience of lean manufacturing!~:mPn9 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510