Equipment & Process Engineer英语读写即可

1) Equipment managementhM3/b5+
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A) Overall control to equipments as individual equipments owner. gW1@L>\b 
A) Continuous improvement to OEE.p4]A,H3}T0 
A) Repairing by on call or shift on dutyRg6h2E=3 
B) Preparation for PM document, service report.;_<.c? 
B) Sourcing new equipment and spare parts to production

2) Process managementPeuGIX2.* 
A) Overall control to processes as individual process owner. X_ld\'h( 
A) Continuous improvement to process capacity.iyfiX|muW 
A) Develop new process introduction to productionB88%SE#co 
B) Preparation for process document, validation report.

Professional Competences3VDms_x 
 Solid understanding on Microelectronic technology lA]-F{ 
 Practice and experience in Foundry, Wafer manufacturingmi+d.?|V 
 Practice and experience in Semiconductor Packaging Process+Kmf4_]- 
 Practice and experience in electronic product assembly technology

QualificationsB(H;5eA#F 
 Bachelor degree or above, major in Microelectronics\electronics+@"zTz\g 
 3 or more years semiconductor packaging production or related experience< %68L'_ 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesD&rb"\B\3 
 Ability to use analysis tools, like MinitabUd.+?~ 
 Ability to use quality control tools, SPC, Six SigmapSWmm 
 Experience of lean manufacturingl{'FHy 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510