Equipment & Process Engineer英语读写即可

1) Equipment management%O5cy>bN 
A) Overall control to equipments as individual equipments owner. HBS"mpQ/; 
A) Continuous improvement to OEE.ksQAr01 
A) Repairing by on call or shift on duty"{GT823] 
B) Preparation for PM document, service report.T&-~# 
B) Sourcing new equipment and spare parts to production

2) Process managementSa0jkEz 
A) Overall control to processes as individual process owner. Q=%vx <9q 
A) Continuous improvement to process capacity.id&$X;\y 
A) Develop new process introduction to productionSIp |py~X8 
B) Preparation for process document, validation report.

Professional Competences"QG:q2p:ED 
 Solid understanding on Microelectronic technology ufr;/rMS 
 Practice and experience in Foundry, Wafer manufacturingIK^8;(zZ+ 
 Practice and experience in Semiconductor Packaging Process
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 Practice and experience in electronic product assembly technology

Qualifications+Eo #{: 
 Bachelor degree or above, major in Microelectronics\electronics-&3r!]?[I 
 3 or more years semiconductor packaging production or related experience|#oW\/;E 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences2j<X,'F 
 Ability to use analysis tools, like Minitabr\6;.WQ 
 Ability to use quality control tools, SPC, Six Sigma!OC5%vk+ 
 Experience of lean manufacturingedE5o.M 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510