Equipment & Process Engineer英语读写即可

1) Equipment managementfo(` -`G 
A) Overall control to equipments as individual equipments owner. jCLH Wd(  
A) Continuous improvement to OEE.=l<gNb$Z 
A) Repairing by on call or shift on duty9}h!iY/Q 
B) Preparation for PM document, service report.>.E8c
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B) Sourcing new equipment and spare parts to production

2) Process managementU35 eQ~{ 
A) Overall control to processes as individual process owner. q^OWw{i* 
A) Continuous improvement to process capacity.5XGKbl8I 
A) Develop new process introduction to productionC^a^d2h@ 
B) Preparation for process document, validation report.

Professional CompetencesZ
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 Solid understanding on Microelectronic technology C,7wW^(, 
 Practice and experience in Foundry, Wafer manufacturing <=\4c'!W 
 Practice and experience in Semiconductor Packaging ProcesssO~/n7FPl 
 Practice and experience in electronic product assembly technology

Qualifications]2:"`]1RZ! 
 Bachelor degree or above, major in Microelectronics\electronics^ _*ifny 
 3 or more years semiconductor packaging production or related experienceJ+&V}ml 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesGr#A}D  
 Ability to use analysis tools, like Minitab i7X:9Cm
 
 Ability to use quality control tools, SPC, Six Sigma-osZNgm* 
 Experience of lean manufacturingdMD7Z?^_ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510