Equipment & Process Engineer英语读写即可

1) Equipment management*!nv[VcX; 
A) Overall control to equipments as individual equipments owner. .@h4 L 
A) Continuous improvement to OEE.F;Y_rR 
A) Repairing by on call or shift on duty2N=`rl<o 
B) Preparation for PM document, service report.BWfmkDiPyb 
B) Sourcing new equipment and spare parts to production

2) Process managementh>f[~(4lUb 
A) Overall control to processes as individual process owner. TJzf%
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A) Continuous improvement to process capacity.>#fzBc|u 
A) Develop new process introduction to production\E}[fz 
B) Preparation for process document, validation report.

Professional Competences4H?1SQlI 
 Solid understanding on Microelectronic technology 2s$ 61[L4 
 Practice and experience in Foundry, Wafer manufacturingN RlmE3; 
 Practice and experience in Semiconductor Packaging ProcessBKJisP]( 
 Practice and experience in electronic product assembly technology

QualificationsYHRy ?!5v  
 Bachelor degree or above, major in Microelectronics\electronics8* Dg'pd_ 
 3 or more years semiconductor packaging production or related experience1'^@+O| 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences\\%ze02N 
 Ability to use analysis tools, like Minitab[<d
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 Ability to use quality control tools, SPC, Six Sigma{bTLXQu 
 Experience of lean manufacturing=(|P 67| 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510