Equipment & Process Engineer英语读写即可

1) Equipment managementmJ9fZ 
A) Overall control to equipments as individual equipments owner. |KBmq % 
A) Continuous improvement to OEE.}t:ZHi 
A) Repairing by on call or shift on dutyH(
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B) Preparation for PM document, service report.N2KB3+nN2 
B) Sourcing new equipment and spare parts to production

2) Process managementS,}&e{x*_  
A) Overall control to processes as individual process owner. s:bq^ 0 
A) Continuous improvement to process capacity.A@!7q~U 
A) Develop new process introduction to productionby9yZ"<W 
B) Preparation for process document, validation report.

Professional Competences:h&/ Y 
 Solid understanding on Microelectronic technology Y`5r&5/`$ 
 Practice and experience in Foundry, Wafer manufacturingxD8{gkM DW 
 Practice and experience in Semiconductor Packaging ProcessIzAtpY`( 
 Practice and experience in electronic product assembly technology

QualificationsG3jTuGt 
 Bachelor degree or above, major in Microelectronics\electronicsx'!+ 8D$p 
 3 or more years semiconductor packaging production or related experience)-:r +> 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesa]qMmF 
 Ability to use analysis tools, like MinitabGuEd|_2z*( 
 Ability to use quality control tools, SPC, Six Sigma!aTnj=F 
 Experience of lean manufacturingYp-:)H|-n 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510