Equipment & Process Engineer英语读写即可

1) Equipment management# HV["* 
A) Overall control to equipments as individual equipments owner. 
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A) Continuous improvement to OEE.ihPvX 
A) Repairing by on call or shift on duty*Ty5AJ 
B) Preparation for PM document, service report.ZVAXC,ug 
B) Sourcing new equipment and spare parts to production

2) Process managementU<ZLNa@ 
A) Overall control to processes as individual process owner. ZJ[?U=(R 
A) Continuous improvement to process capacity. _8x!p 
A) Develop new process introduction to production7i1)r2En>_ 
B) Preparation for process document, validation report.

Professional Competences 0&PzrVN 
 Solid understanding on Microelectronic technology u?DR{ 
 Practice and experience in Foundry, Wafer manufacturing+]}q& 
 Practice and experience in Semiconductor Packaging ProcesswDG0$nTC 
 Practice and experience in electronic product assembly technology

Qualifications#eh5F I4 
 Bachelor degree or above, major in Microelectronics\electronicskoaD{ /Dv 
 3 or more years semiconductor packaging production or related experienceMr:^ci6_M 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences e r@:je 
 Ability to use analysis tools, like Minitab'y0B4Hzc 
 Ability to use quality control tools, SPC, Six SigmaS[#eCk5}U 
 Experience of lean manufacturing
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 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510