Equipment & Process Engineer英语读写即可

1) Equipment management2&$ ^t(D 
A) Overall control to equipments as individual equipments owner. BW)`X'" 
A) Continuous improvement to OEE.
wY ?e 
A) Repairing by on call or shift on dutyxm-Qm@fB  
B) Preparation for PM document, service report.Tpo=bh, 
B) Sourcing new equipment and spare parts to production

2) Process management0M2T&V<9 
A) Overall control to processes as individual process owner. |KN*G^n 
A) Continuous improvement to process capacity.>q[L}$: 
A) Develop new process introduction to production?|{AaaA 
B) Preparation for process document, validation report.

Professional CompetencesE-Ynae$* 
 Solid understanding on Microelectronic technology HfzH$[BLC 
 Practice and experience in Foundry, Wafer manufacturingD=}P|= 
 Practice and experience in Semiconductor Packaging ProcessNT;b}B v 
 Practice and experience in electronic product assembly technology

QualificationsaUMTc\G V 
 Bachelor degree or above, major in Microelectronics\electronics=7Z.|; 
 3 or more years semiconductor packaging production or related experience"4OTpF{$( 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesur+3ai1; 
 Ability to use analysis tools, like MinitabaJi}B
a 
 Ability to use quality control tools, SPC, Six SigmaM$c@%y'a-; 
 Experience of lean manufacturingx~'RNs 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510