Equipment & Process Engineer英语读写即可

1) Equipment management'="jO:J]; 
A) Overall control to equipments as individual equipments owner. 5y8o0v 
A) Continuous improvement to OEE.7Dr x&I$( 
A) Repairing by on call or shift on duty|q Z7c{ 
B) Preparation for PM document, service report.lR]S+l*O 
B) Sourcing new equipment and spare parts to production

2) Process management;YoZoP$ 
A) Overall control to processes as individual process owner. *}bc^& % 
A) Continuous improvement to process capacity.cS^F>tmu 
A) Develop new process introduction to productionK/ :~U~| 
B) Preparation for process document, validation report.

Professional Competencesjd9>XFf 
 Solid understanding on Microelectronic technology x)w*A5J 
 Practice and experience in Foundry, Wafer manufacturing\CStpoj 
 Practice and experience in Semiconductor Packaging ProcessE:+eLHg1 
 Practice and experience in electronic product assembly technology

QualificationsV%O{rQC$s4 
 Bachelor degree or above, major in Microelectronics\electronics5(:h%[ah 
 3 or more years semiconductor packaging production or related experience)]w P?<W 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competenceso{kn s!C 
 Ability to use analysis tools, like MinitabYCnuFt>D1v 
 Ability to use quality control tools, SPC, Six SigmaO_wtR=S`]C 
 Experience of lean manufacturingxUQPz+r"W 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510