Equipment & Process Engineer英语读写即可

1) Equipment management3!v
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A) Overall control to equipments as individual equipments owner. <]DXT? 
A) Continuous improvement to OEE.F8-Boi]o 
A) Repairing by on call or shift on dutyT< 0b] 
B) Preparation for PM document, service report.MsRL|)a5 K 
B) Sourcing new equipment and spare parts to production

2) Process management7
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A) Overall control to processes as individual process owner. (}E{D DH6 
A) Continuous improvement to process capacity.dm\zm 
A) Develop new process introduction to production6W]=g-g 
B) Preparation for process document, validation report.

Professional CompetencesnJMqh}-71[ 
 Solid understanding on Microelectronic technology ).5sQlK 
 Practice and experience in Foundry, Wafer manufacturing9rgxyZ<mb< 
 Practice and experience in Semiconductor Packaging Processd['YL. 
 Practice and experience in electronic product assembly technology

Qualifications-4)Rk 
 Bachelor degree or above, major in Microelectronics\electronicsCa'RGY 
 3 or more years semiconductor packaging production or related experienceI*QQ,Ef5Gb 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesXB Z920 
 Ability to use analysis tools, like MinitabYtSFeEg 
 Ability to use quality control tools, SPC, Six SigmaFFjOgAvg 
 Experience of lean manufacturingl]vCjj 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510